Persamaan irf6303/11/2023 It provides the highest power capability and the lowest possible on resistance in any existing surface mount package. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry. The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. Fifth Generation HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.
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